Up to now it was not possible to reliably (and fast) find microcracks and inclusions in solar wafers:

Conventional image processing methods are either not able to see all cracks or cannot distinguish microcracks from grain boundaries in polycrystalline silicon wafers. This produces slip-through and pseudo scrap at the same time.

QuaVis Technologies GmbH has developped a completely new way to detect such matrial defects.

Our systems can be used offline as well as inline and allow a throughput of up to 2 wafers per second.
All wafer geometries are supported.

Please have a look at our product flyer to get detailed information oder contact us directly.